Enterprise WiFi

RQ94-5

WiFi 7 IEEE 802.11be 5GHz 4x4 M.2 Radio Card

  • WiFi 7 IEEE 802.11a/b/g/n/ac/ax/be 5GHz radio card
  • Supports MIMO 4x4 5GHz WiFi operations
  • Supports WiFi PHY rate of 8,648Mbps (240 or 320-80MHz)
  • Based on Qualcomm QCN9274 Wikiki SoC
  • FEM: Qorvo QPF4559
  • Filter: Acoustic A10655
  • 4 x U.FL antenna connectors
  • 2Mb EEPROM is integrated
  • Interfaces: PCIE Gen3 dual lands
  • Form factor: M.2 Key E
  • Dimension: 62.5 x 57mm
WiFi 7
Inquiry

The RQ94-5 series are IEEE 802.11be (WiFi 7) 4x4 radio module with Qualcomm Wikiki SoC integrated. It can deliver up to 26dBm (4 streams combined) output power making it a perfect WiFi 7 radio card WiFi, SDWAN/UTM and IOT (Internet Of Things) applications.
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Specifications
Module
WiFi 7 802.11be 5GHz 4X4 M.2 radio card
WLAN Standatd
IEEE 802.11 a/b/g/n/ac/ax/be
SoC/CPU
Qualcomm QCN9274 2/5/6GHz Wikiki SoC, 320MHz, c-temp 
FEM
Qorvo QPF4559 high power FEM
Filter
Acoustic A10655 high isolation BAW filter
Memory
EEPROM 2Mb
Radio Mode
MIMO 4x4
Radio Frequency Band
5.150-5250GHz, 5.250-5.350GHz, 5.470-5.725GHz, 5.725-5.825GHz
Transmit Power
20dBm MCS0 EHT20
16dBm MCS13 EHT20
20dBm MCS EHT40
15dBm MCS13 EHT40
19dBm MCS EHT80
15dBm MCS13 EHT80
19dBm MCS EHT160
15dBm MCS13 EHT160
Receive Sensitivity
-92.0dB MCS0 VHT20
-61.0dB MCS13 VHT20
-90.0dB MCS0 HE20
-55.0dB MCS13 HE20
-89.0dB MCS0 EHT20
-55.0dB MCS13 EHT20
-83.5dB MCS0 EHT160
-51.5dB MCS13 EHT160
Channel Size 
20/40/80/160/240MHz(320-80)
Modulation
DSSS: BPSK/QPSK/CCK
OFDM: BPSK, QPSK, CCK, 16/64/256/1024QAM
OFDMA: BPSK, QPSK, CCK, 16/64/256/1024/4096QAM
Data Rates 
Up to 8,648Mbps, 4x4 MIMO (240MHz or 320-80MHz channel)
Security
AES-CCMP, GCMP hardware processing
Power Consumption
Typical 8.5W, 25°C (preliminary)
Temperature
Operating Temperature: -10°C ~ +70°C
Storage Temperature: -40°C  ~ +90°C
Humidify
Operating Humidify: 5%-95% (Non-condensing)
Dimension
62.5 (L) x 57 (W) x 3 (H) mm
Weight
<40g
Antenna
4 x U.FL connectors
Power Supply
Deafult +5V
Interfaces
PCIE3.0 2L
Remark
*The shielding cover is included for MP units
*Heatsink and thermal solution should be designed and integrated with the end device mechanical design; 
* Per Qualcomm, additional EMI solution should be implemented on the main board, pls refer to Qualcomm document:  "80_71472_1_AA_WSI_Emission_Mitigation_on_IPQ9574_a”
Debian 11.8 Bullseye with kernel v5.10